Senior PCB Design & Analysis Engineer - PAC-3

Company: BOEING
Location: Paint Rock
Posted on: April 10, 2021

Job Description:

The Boeing Defense, Space & Security (BDS) organization is seeking a Senior PCB Design & Analysis Engineer to join the Design Engineering Team in Huntsville, AL on the Patriot Advanced Capability (PAC-3) missile-defense program.The Design Engineering team is responsible for designing RADAR seeker upgrades and next generation concepts, as well as supporting production and special test equipment design. Boeing has a multi-year contract to develop, test, and manufacture the PAC-3 RADAR seeker. This program encompasses concurrent design, test and manufacturing as new upgrades to this complex electro-mechanical assembly are incorporated into production. This long-term program is rapidly growing in Huntsville, Alabama due to design updates, production growth, and Boeing facilities consolidations.Position Responsibilities:

• Leads the design, layout and routing of digital, analog, radio frequency (RF) and high power printed circuit boards (PCB) using Mentor Graphics
• Creates and maintains component library database of schematic symbols and component land patterns per Institute for Printed Circuits (IPC), Joint Electron Device Engineering Council (JEDEC), Corporate, and Military Standards
• Generates PCB design packages (i.e. Gerber files, fabrication drawings, assembly drawings, etc.)
• Leads the modeling/simulations of high data rate signals, power distribution and RF signaling on PCBs
• Performs lab measurements and correlates to simulation as well as refine future models
• Performs signal/power integrity simulation and analysis of electronic assemblies and their constituent parts which may include:multiple die/chiplets, Ball-Grid-Array (BGA) substrates, high speed memory, printed-wiring-boards, packages, and materials
• Leads reviews of testing and analysis activity to assure compliance to requirements
• Supports development of statements-of-work and technical performance specifications
• Develops of test plans/procedures and supports the execution test events
• Leads collaboration with internal teams and PCB vendors to continually improve design rules, constraints and design for manufacture, assembly and test guidelines
• Develops Design for Manufacture and Assembly (DFMA) guidelines
• Leads formal trade studies and literature research to support future product designs
• Recognized as a job expert within the department/organizationWork Authorization:This position requires the ability to obtain a U.S Security Clearance for which the US Government requires US Citizenship. An interim and/or final U.S. secret clearance Post Start is required.Basic Qualifications (Required Skills/Experience):
  • Bachelor's, Master's or Doctorate of Science degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry
  • 9 or more years of experience in electrical engineering (or PhD +4 / Masters +3 years related work experience), with specific experience in the following areas:
  • 7 or more years of experience with Schematics capture, PCB design, layout and routing with Mentor Graphics or another PCB design suite
  • 4 or more years of experience performing signal and power integrity design, simulation, and analysis of electronic assemblies
  • 5 or more years of experience with electronics test methodologyPreferred Qualifications (Desired Skills/Experience):
    • Bachelor, Master or Doctorate of Science degree in Electrical/Computer Engineering or related science or technology field degree
    • Experience with PCB layout and routing of modern active/passive electronic components, surface mount, RF components, ball-grid array and other high density components using Mentor Graphics
    • Experience managing/leading engineering projects
    • Experience effectively communicating and collaborating on multi-discipline teams
    • Experience mentoring junior engineers
    • Experience leading multi-discipline design teams or a special project teams
    • Experience in multiple focused areas: analog/digital circuits, gimbal design/control, power supply and distribution, firmware/Field Programmable Gate Array (FPGA), LabView, control systems, RF theory, Electro Magnetic Compatibility.
    • Experience of Printed Wiring Board (PWB) design processes
    • Experience of a broad range of hardware types including RF assemblies, antennas, power supplies (alternating current/direct current (AC/DC)), FPGAs, digital signal processors, and embedded architectures
    • Experience of antennas, wave guides, gimbals, filters, complex electronics, RF signal processing, RF amplifiers, RF transceivers, Intermediate Frequency Processing, and/or serial rapid Input/Output (I/O) interfaces (SRIO)
    • Experience of digital and RF test equipment including signal generators, network analyzers, spectrum analyzers, and oscilloscopesTypical Education / Experience:Typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 9 or more years' related work experience or an equivalent combination of technical education and experience (e.g. PhD+4 years' related work experience, Master+7 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.Relocation:This position offers relocation based on candidate eligibility. Basic relocation plan is being offered for internal candidates.Drug Free Workplace:Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.Shift:This position is for 1st shiftReferral to this job is eligible for bonus.

Keywords: BOEING, Huntsville , Senior PCB Design & Analysis Engineer - PAC-3, Engineering , Paint Rock, Alabama