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Mid Level PCB Design & Analysis Engineer - PAC-3

Company: BOEING
Location: Somerville
Posted on: February 22, 2021

Job Description:

The Boeing Defense, Space & Security (BDS) organization is seeking a Mid Level PCB Design & Analysis Engineer to join the Design Engineering Team in Huntsville, AL on the Patriot Advanced Capability (PAC-3) missile-defense program.

The Design Engineering team is responsible for designing RADAR seeker upgrades and next generation concepts, as well as supporting production and special test equipment design. Boeing has a multi-year contract to develop, test, and manufacture the PAC-3 RADAR seeker. This program encompasses concurrent design, test and manufacturing as new upgrades to this complex electro-mechanical assembly are incorporated into production. This long-term program is rapidly growing in Huntsville, Alabama due to design updates, production growth, and Boeing facilities consolidations.

Position Responsibilities:

Supports the design, layout and routing of digital, analog, radio frequency (RF) and high power printed circuit boards (PCB) using Mentor Graphics


Creates and maintains component library database of schematic symbols and component land patterns per Institute for Printed Circuits (IPC), Joint Electron Device Engineering Council (JEDEC), Corporate, and Military Standards


Generates PCB design packages (i.e. Gerber files, fabrication drawings, assembly drawings, etc.)


Supports the modeling/simulations of high data rate signals, power distribution and RF signaling on PCBs


Performs lab measurements and correlates to simulation as well as refine future models


Performs signal/power integrity simulation and analysis of electronic assemblies and their constituent parts which may include:multiple die/chiplets, Ball-Grid-Array (BGA) substrates, high speed memory, printed-wiring-boards, packages, and materials


Supports reviews of testing and analysis activity to assure compliance to requirements


Supports development of statements-of-work and technical performance specifications


Develops of test plans/procedures and supports the execution test events


Leads collaboration with internal teams and PCB vendors to continually improve design rules, constraints and design for manufacture, assembly and test guidelines


Develops Design for Manufacture and Assembly (DFMA) guidelines


Supports formal trade studies and literature research to support future product designs


Possesses general knowledge of other related disciplines



Work Authorization:

This position requires the ability to obtain a U.S Security Clearance for which the US Government requires US Citizenship. An interim and/or final U.S. secret clearance Post Start is required.

Basic Qualifications (Required Skills/Experience):

Bachelor's, Master's or Doctorate of Science degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry


5 or more years of experience in electrical engineering (or PhD or Masters +3 years related work experience) with specific experience in the following areas:


4 or more years of experience with Schematics capture, PCB design, layout and routing with Mentor Graphics or another PCB design suite


3 or more years of experience performing signal and power integrity design, simulation, and analysis of electronic assemblies


3 or more years of experience with electronics test methodology



Preferred Qualifications (Desired Skills/Experience):

Bachelor, Master or Doctorate of Science degree in Electrical/Computer Engineering or related science or technology field degree


Experience with PCB layout and routing of modern active/passive electronic components, surface mount, RF components, ball-grid array and other high density components using Mentor Graphics


Experience in one or more of these focused areas: analog/digital circuits, gimbal design/control, power supply and distribution, firmware/Field Programmable Gate Array (FPGA), LabView, control systems, RF theory, Electro Magnetic Compatibility.


Good communication, analytical, and organizational skills.


Ability to work in a team environment


Previous design team or special project team participation


Experience of Printed Wiring Board (PWB) design processes


Experience of a broad range of hardware types including RF assemblies, antennas, power supplies (alternating current/direct current (AC/DC)), FPGAs, digital signal processors, and embedded architectures


Experience of antennas, wave guides, gimbals, filters, complex electronics, RF signal processing, RF amplifiers, RF transceivers, Intermediate Frequency Processing, and/or serial rapid Input/Output (I/O) interfaces (SRIO)


Experience of digital and RF test equipment including signal generators, network analyzers, spectrum analyzers, and oscilloscopes



Typical Education / Experience:

Typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 5 or more years' related work experience or an equivalent combination of technical education and experience (e.g. PhD, Master+3 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation

Relocation:

This position offers relocation based on candidate eligibility. Basic relocation plan is being offered for internal candidates.

Drug Free Workplace

Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.

Shift:

This position is for 1st shift

Referral to this job is eligible for bonus.

Keywords: BOEING, Huntsville , Mid Level PCB Design & Analysis Engineer - PAC-3, Engineering , Somerville, Alabama

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